In our first update email, we gave a quick overview of where we are on starting Framework Laptop 16 manufacturing and a list of open issues. There are still a handful of firmware items that are open and module production dates that are pending for full system production. However, we’ve made excellent progress in the last two weeks, and we’re happy to share that Mainboard mass production has started! This means the first set of final Mainboards are flowing down the manufacturing line this week at our factory in Taiwan. We’ll run them through the normal testing procedures and hold them while we prepare for full system manufacturing.

We’re eager to close out the rest of the opens, build the first units, and get them out to you all. We have a list of the remaining open items below, along with the issues from the last update that are now resolved.

New issues

  1. High pitched airflow noise in the Graphics Module fan - We identified an airflow path in the Graphics Module fan that could result in a high pitch noise. This is another issue that was resolved in DVT2, but we found a regression in it during pre-mass production sample checking. Our supplier was able to resolve the issue with an adjustment to one of the internal mechanical parts in the fan that guides the airflow path. We’re now determining whether there is any impact to the schedule from needing to adjust tooling and rework already produced fans, but we don’t expect this to be the long pole in the schedule.

In progress

  1. The fans have a small chirping noise on startup - Our fan supplier was able to root cause the issue and revise the fan to remove the chirping noise. The initial production schedule for updated fans is currently the longest pole for our system production schedule, so we’re working closely with the supplier to find ways to shorten it.
  2. Power tuning during heavy loading - Our graphics card provider was able to revise the card and is proceeding into production on it. Even though the issue is resolved, we’re tracking it as “in progress” since Graphics Module manufacturing is one of the longer pole items on our production schedule. We’re also continuing to tune firmware to maximize performance across different power scenarios (on full battery, on low battery, on a 100W adapter, on a 180W adapter, on a 240W adapter, etc)
  3. Graphics Module compatibility issues in Linux - We’re still working closely with the team at AMD to debug Linux compatibility issues on the Graphics Module. Our current assumption is that VBIOS firmware needs to be modified. Linux compatibility is extremely important, and we’re committed to making sure it is smooth before launch.
  4. USB-PD firmware is in the process of completion - With the Framework Laptop 16 being the first product on the market supporting 180W and 240W USB-C along with a complex scheme for handling Expansion Cards, our USB-PD firmware is complicated. Implementation is nearly complete, and we also want to ensure we do sufficient testing before our target 12/8 mass production internal firmware release.
  5. LED Matrix module schedule is trending late - We’re working with the supplier to pull in their schedule to meet launch timing, but it is still trending late.

Resolved issues

  1. Cosmetic issues on aluminum forming parts using high recycled material content - We’ve completed process tuning and set cosmetic criteria that gives good results without resulting in excessive yield loss for production. In parallel, we’re working with the aluminum parts supplier on an improved source for post-consumer recycled material to use in the long run.
  2. Our Numpad vendor used out of spec resistors - Our supplier was able to build new interface boards with the correct resistors, and their overall module production is on schedule.
  3. Tuning capacitor noise - Our supplier was able to switch some capacitors to low noise variants and adjust the slew rate on some power rails, which substantially reduced noise.
  4. Expansion Bay Interposer manufacturing yields - The interposer manufacturer was able to tune the tooling and assembly process on the custom connector, and yields are at the level required for production. The timing of production quantities is currently on track to meet our system production. We’re really excited about this connector, and will be sharing more detail in an upcoming blog post on how it enables GPU modularity.
  5. Late display firmware update - We were able to roll out a new EDID into panel production that enables DCI-P3 correctly, and panel deliveries are on track for system production.